Technology area
Design guide
Technology area
Design guide
TECHNOLOGY DRIVEN ELECTRONIC COMPANY
- Specifications of Manufacturing Process
Drill & Plating
Pattern & Coverlay
PSR & Marking Printing
Surface treatment & BBT
External Processing
Surface treatment
| Category | Item | Specifications | Other |
|---|---|---|---|
| Surface treatment | Electroplating | Ni : 3~8㎛ Au : 0.3~0.8㎛ | Plating write connection required |
| Electroless plating | Normal Ni : 3~8㎛ Au : Min 0.4㎛ | ||
| Special Ni : 1~3㎛ Au : Min0.05㎛ | |||
| Electroplating in Sn | 2~15㎛ | ||
| Electroless tin plating | 0.43~0.8㎛ | Plating write connection required | |
| Direct gold | 0.1~0.8㎛ | Plating write connection required |
- Consultation required for other details of plating.
BBT
| Category | Item | Specifications |
|---|---|---|
| BBT | Open resistance | 5Ω |
| Short resistance | 20㏁ | |
| Open electric current value | 205V | |
| Short electric current value | 205V |
Mongnae-ro 6, Danwon-gu, Ansan-si, Gyeonggi-do (Mongnae-dong, Lot # 32-1, Block 7, Banweol Industrial Complex) TEL. +82-31-491-6795 FAX. +82-31-491-6793
