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기술분야

디자인 가이드

TECHNOLOGY DRIVEN ELECTRONIC COMPANY

Specifications of Manufacturing Process

Drill

TABLE
Category Item SPEC Classification
Normal Drill Min HoleØ Min 0.1Ø , Max 6.0Ø PTH
Min HoleØ Min 0.15Ø BVH (BURIED)
Min HoleØ Min 0.15Ø PTH
Min Via Land Min 0.3Ø
Laser Drill Min HoleØ Min 0.05Ø PTH
Max HoleØ Max 0.15Ø PTH
Min Via Land Min 0.25Ø
Common Distance from hole to adjacent circuit Min 0.2mm (on edge) Instrument hole (NPTH)
  • There should be no drilling on the separation.
  • Laser drill cannot work through more than 2 layers.

Cu Plating

TABLE
Category Item Specifications
Copper plate D/S FPCB 12 ㎛ ±3 ㎛
Mulit FPCB 15 ㎛ ±5 ㎛
Rigid - FLEX style : Rgid FPCB 15 ㎛ ±5 ㎛
  • Via hole Cu plate thickness.
  • FCCL Cu plate thickness.
  • Specifications for other thickness than the above-listed must be checked with related division.