Technology area
Structure of FPCB
Technology area
Structure of FPCB
Multi-Layer
TECHNOLOGY DRIVEN ELECTRONIC COMPANY
- Multi-Layer
- Gloflex will become a company that continuously struggle and challenge toward the global best position with the core value and the core strategies.
Main features
- Realizes high density circuit applying static electricity shielding effect
- Realizes multi-layer FPCB via an invisible VIA hole
- Miniaturization and higher function of home and communication appliances that requires multi-layered products to mount more circuits and parts in a same sized product
Usage
- Product - Digital camera , camcoder , monitor , mobile phone
- Office equipment - copy machine , PDA
- Car - HEAD LAMP
- Computer and peripherals
Specification
| ITEM | SPEC |
|---|---|
| Layers | 3~8 |
| Base Material | Polyimide or Polyester |
| Cover-lay | Polyimide or Polyester or Solder Mask |
| Thickness | 0.2mm~0.8mm |
| Line Width/Space | Normal Min, 0.07/0.07mm, Special Min. 0.06/0.06mm |
| Conductor | 1/3oz, 1/2oz, 1oz, ED or RA Copper |
| Surface finish | Electroless nikel immersion Gold, Direct Gold,soft gold, Hard Gold |
| Stiffener | Polyimide, Glass epoxy, Steel use stainless |
| Double coated tape | Coated Tape 3M 467 , 966 ,Sony D3410 , T4100 etc |
| Min. through hole diameter | Bit Drill Via Normal Min. 0.02mm Special Min. 0.150mm |
| Hole diameter tolerance | 10% |
| Solder resist | Photo Solder Resist, Polyimide flim |
Mongnae-ro 6, Danwon-gu, Ansan-si, Gyeonggi-do (Mongnae-dong, Lot # 32-1, Block 7, Banweol Industrial Complex) TEL. +82-31-491-6795 FAX. +82-31-491-6793
